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Job description
Astranis builds advanced satellites for high orbits, expanding humanity’s reach into the solar system. Today Astranis satellites provide dedicated, secure networks to highly-sophisticated customers across the globe – large enterprises, sovereign governments, and the US military.
With five satellites on orbit and many more set to launch soon, the company is servicing a backlog of more than $1 billion of commercial contracts. Astranis is the preferred satellite communications partner for buyers with stringent requirements for uptime, data security, network visibility, and customization.
Astranis has raised over $1.2 billion from some of the world’s best investors, including Andreessen Horowitz, Baillie Gifford, Blackrock, Fidelity, Franklin Templeton, and Snowpoint, and employs a team of 500 engineers and entrepreneurs. Astranis designs, builds, and operates its satellites out of its 153,000 sq. ft. headquarters in Northern California, USA.
PCBA Electronics Rework Technician
As an Electronics Technician at Astranis, you'll be working in a fast paced environment supporting avionics, power, and payload systems. You'll be building a wide variety of circuit boards. You'll work on cutting edge builds supporting research and development and contributing to production builds to meet rate.
Role
- Rework, assemble, and debug printed circuit board assembly's (PCBAs)
- Inspect incoming boards to IPC-610 Class 2/3 standards
- Apply, remove, and rework conformal coating, staking, and other polymeric adhesives
- Leadform, reball and degold components to match engineering footprints and drawings
Requirements
- High school diploma or GED equivalent
- 2+ years of experience working hands-on as a technician in the aerospace, automotive, or similar industries
- Electrical rework and soldering skills (0201 components)
- Excellent attention to detail
- Must be onsite 5 days a week
Bonus
- IPC-A-610 or J-STD-001 certification
- Experience working with Altium Nexus or reading drawing notes
- Advanced soldering and rework skills (BGA, QFN or similar high density packages)
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