Photonics Packaging Engineer

Remote

  • SF Bay Area · Boston
  • Posted 105 days ago
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Job description

What We're Looking For:

We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. 

This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.

Ideal Background

  • Experience with integrated photonics package assemblies with multiple dies 
  • Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
  • Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc. 

Nice to Have

  • Experience with large device count photonic assemblies 
  • Experience with clear underfill
  • Experience with high density fiber attach
  • Experience with large substrate size photonic MCM assemblies 
  • Hands-on experience with PIC design

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